- Published: 15 March 2017
- Written by Editor
MicroVision Receives First Order for Small Form Factor Display Engine for $6.7 Million
Asian electronics device manufacturer to embed MicroVision display engine in smartphones for China and other markets
MicroVision, Inc. (NASDAQ: MVIS), a leader in innovative ultra-miniature projection display and sensing technology, today announced that it has received a $6.7 million order for its small form factor display engine (model PSE-0403-103) from an Asian electronics device manufacturer. The customer plans to embed the MicroVision display engines in smartphones.
The electronics Original Equipment Manufacturer (OEM) plans to launch the smartphone product later this year in China and other markets where it has existing distribution of its products. Currently MicroVision expects to begin shipping engines to the OEM in the second quarter of 2017 with a large majority of the units shipping by the end of 2017. Actual timing of shipments of the PSE-0403-103 to this OEM will be finalized in line with the OEM’s product launch timing. Other details of the product or agreement between MicroVision and the OEM are confidential.
This order demonstrates how the small form factor display engine MicroVision announced in November 2016 is suited to applications where small size and power efficiency are required and where flexible design of the module is needed by the OEM. The electronics OEM that is designing the smartphone with an embedded projector required an electronics board layout that varied from the standard form of MicroVision’s PSE-0403-101 display engine. MicroVision was able to quickly design a form factor that met the requirements of the OEM and could be manufactured by MicroVision’s supply chain partner. This module, PSE-0403-103, uses the same MEMS and ASICS1 components as the standard MicroVision PSE-0403-101 engine with a configuration that supports the design of the OEM’s product.
MicroVision began shipping samples of its small form factor display engine to customers, including this OEM, in December 2016.
1 Micro-electrical mechanical systems (MEMS) and Application-specific integrated circuits (ASICS)
MicroVision is the creator of PicoP® scanning technology, an ultra-miniature laser projection and sensing solution based on the laser beam scanning methodology pioneered by the company. MicroVision's platform approach for this advanced display and sensing solution means that it can be adapted to a wide array of applications and form factors. It is an advanced solution for a rapidly evolving, always-on world. Extensive research has led MicroVision to become an independently recognized leader in the development of intellectual property. MicroVision’s IP portfolio has been recognized by the Patent Board as a top 50 IP portfolio among global industrial companies and has been included in the Ocean Tomo 300 Patent Index. The company is based in Redmond, Wash.
For more information, visit the company’s website at www.microvision.com, on Facebook at www.facebook.com/MicroVisionInc or follow MicroVision on Twitter at @MicroVision.
MicroVision and PicoP are trademarks of MicroVision, Inc. in the United States and other countries. All other trademarks are the properties of their respective owners.
Certain statements contained in this release, including those relating to fulfillment of purchase orders and future product and product applications are forward-looking statements that involve a number of risks and uncertainties. Factors that could cause actual results to differ materially from those projected in the company's forward-looking statements include the following: our ability to raise additional capital when needed; products incorporating our PicoP® scanning technology may not achieve market acceptance, commercial partners may not perform under agreements as anticipated, we may be unsuccessful in identifying parties interested in paying any amounts or amounts we deem desirable for the purchase or license of IP assets, our or our customers failure to perform under open purchase orders; our financial and technical resources relative to those of our competitors; our ability to keep up with rapid technological change; government regulation of our technologies; our ability to enforce our intellectual property rights and protect our proprietary technologies; the ability to obtain additional contract awards; the timing of commercial product launches and delays in product development; the ability to achieve key technical milestones in key products; dependence on third parties to develop, manufacture, sell and market our products; potential product liability claims; and other risk factors identified from time to time in the company's SEC reports, including the company's Annual Report on Form 10-K filed with the SEC. Except as expressly required by federal securities laws, we undertake no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events, changes in circumstances or any other reason.
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