MicroVision Awarded Development and Supply Contract for Laser Beam Scanning System by a Leading Technology Company

Contract includes $24 million for non-recurring development fees and other items and includes an upfront payment
 
REDMOND, Wash. --  MicroVision, Inc. (NASDAQ: MVIS), a leader in innovative ultra-miniature projection display and sensing technology, today announced that it has signed a significant contract with a major technology company to develop a Laser Beam Scanning (LBS) display system and to produce MicroVision specific components.
 
Under this agreement, MicroVision would develop a new generation of MEMS1, ASICs2 and related firmware for a high resolution, LBS based product the technology company is planning to produce. MicroVision would receive up to $24 million including $14 million in fees for development work that is expected to span 21 months and an upfront payment for other items. The development fees would be paid contingent on completion of milestones in 2017 and 2018. Further details on the milestone timing, amounts related to the milestones, quantity of components and other details of the contract are not being made public.
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Akoustis Signs Definitive Agreement to Acquire 120,000 Sq. Ft. Wafer Manufacturing Facility and Operation to Internalize Production of Its Patented, Single Crystal BAW RF Filters

- Acquisition Includes 150-mm Wafer Manufacturing Tools, 57-acres of Real Property and MEMS Business with $3M/year in Annual Revenue -
- Akoustis Expects to Achieve Shorter Time-To-Market by Consolidating Its Patented Single-Crystal Materials, Wafer Fabrication and RF Filter Manufacturing into Acquired Commercial Facility ----- Transaction Significantly Expands Wafer Capacity for R&D and BAW RF Filter Production -
- Akoustis Has Produced First Experimental Single-Crystal BAW Wafers in New Facility -
 
CHARLOTTE, N.C. and ALBANY, N.Y., March 24, 2017 -- Akoustis Technologies, Inc. (NASDAQ:AKTS) (“Akoustis” or the “Company”), a manufacturer of patented single-crystal BulkONE® bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today it has entered into  binding, definitive agreements to acquire assets from the Research Foundation for the State University of New York (RF-SUNY) and Fuller Road Management Corporation (FRMC), an affiliate of RF-SUNY. 
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MicroVision Receives First Order for Small Form Factor Display Engine for $6.7 Million

Asian electronics device manufacturer to embed MicroVision display engine in smartphones for China and other markets
 
MicroVision, Inc. (NASDAQ: MVIS), a leader in innovative ultra-miniature projection display and sensing technology, today announced that it has received a $6.7 million order for its small form factor display engine (model PSE-0403-103) from an Asian electronics device manufacturer. The customer plans to embed the MicroVision display engines in smartphones.
 
The electronics Original Equipment Manufacturer (OEM) plans to launch the smartphone product later this year in China and other markets where it has existing distribution of its products. Currently MicroVision expects to begin shipping engines to the OEM in the second quarter of 2017 with a large majority of the units shipping by the end of 2017. Actual timing of shipments of the PSE-0403-103 to this OEM will be finalized in line with the OEM’s product launch timing. Other details of the product or agreement between MicroVision and the OEM are confidential.
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Superconductor Technologies Inc. Awarded U.S. Patent for Unique Manufacturing Process

– Strengthens Conductus Superconducting Wire IP portfolio –
 
AUSTIN, Texas, Feb. 16, 2017 -- Superconductor Technologies Inc. (STI) (Nasdaq:SCON) was awarded a U.S. Patent enabled by STI’s proprietary superconducting wire manufacturing method. This patented process improves Conductus® wire’s performance in the presence of a strong magnetic field.
 
U.S. Patent No. 9,564,258 entitled “Coated Conductor High Temperature Superconductor Carrying High Critical Current Under Magnetic Field By Intrinsic Pinning Centers, And Methods Of Manufacture Of Same” from the U.S. Patent and Trademark Office (USPTO), associated with U.S. Patent No. 9,362,025 announced in June 2016, provides additional protection for STI’s unique manufacturing process.
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GigPeak Reports Record Financial Performance for the Fourth Quarter and Fiscal Year 2016 and Enters Into a Definitive Agreement to Be Acquired in an All Cash Transaction by Integrated Device Technology, Inc.

SAN JOSE, Calif. -- GigPeak, Inc. (NYSE MKT:GIG): In a separate announcement, it was announced today that GigPeak has entered into a definitive agreement to be acquired in an all cash transaction by Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), for total cash consideration of $3.08 per share, or approximately $250 million in cash, including various expenses and amounts paid to employees and directors
Under the terms of the agreement, IDT will commence a cash tender offer for all outstanding shares of GigPeak for $3.08 per share in cash. This per share consideration would represent a premium of approximately 22% to GigPeak’s closing share price on February 10, 2017, and an approximately 30% premium to its last 9-month average trading price as of February 10, 2017
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