ParkerVision, Inc. and LG Innotek Enter into Joint Development Agreement

LG Innotek to Incorporate ParkerVision's RF Technology into Multi-Mode Wireless Modules with Product Launch Targeted in Second Half of 2009

JACKSONVILLE, Fla., Dec. 4 /PRNewswire-FirstCall/ -- ParkerVision, Inc. (Nasdaq: PRKR), announced today that it has entered into a joint development agreement with LG Innotek, a division of the LG Group and a global market leader in the manufacture and sale of key electronic components. Under the terms of the agreement, ParkerVision will supply unpackaged RFICs that incorporate the company's proprietary d2p(TM) and d2d(TM) technologies, for the reception, transmission and amplification of RF carrier signals. LG Innotek will incorporate these RFICs into multi-mode wireless modules for sale by LG Innotek to their customer base of mobile handset and wireless data card manufacturers.

Fujitsu Microelectronics, Gennum Corporation, Develop New Solution to Expand Data Center Bandwidth, Reduce 10 Gigabit Ethernet Power and Cost

Case Study Reviews the Application of SFP+ Architecture to Lower Costs by $40 per Port, Power by 1 W per Port

Fujitsu Microelectronics America, Inc. (FMA) and Gennum Corporation (TSX: GND) today issued a new case study describing how the companies combined forces to develop 10 Gigabit Ethernet (10GbE) technology that reduces cost and power while boosting data-center bandwidth.

The new case study, entitled "Reducing Power and Costs of 10G Solutions in Data Centers," provides a comprehensive description of a solution using Fujitsu's 26-port, 10GbE switch IC, the MB86C69RBC, with SFP+ modules embedded with Gennum's 10G CDR technology. Use of the SFP+ modules results in significant power savings, lower component count, lower cost manufacturing and the ability to pay as ports are populated on an as-needed basis.

SiRF Debuts SiRFlinkIII Combo Radio IC to Drive Next-Generation Mobile Convergence Devices

Continuing its leadership in driving higher levels of integration for GPS-enabled mobile devices, SiRF Technology Holdings, Inc. (Nasdaq: SIRF), a leading provider of GPS-powered location platforms, today unveiled the SiRFlinkIII(TM) combination radio IC. The SiRFlinkIII single-chip solution combines a high-performance GPS RF front end and a complete Bluetooth 2.1 + EDR controller optimized for use with the SiRFatlas(TM) and SiRFprima(TM) multifunction SoC platforms. Available now with a well developed reference design and software drivers, the SiRFlinkIII solution is designed to drive its on-chip Bluetooth radio at full class 2.0 power while providing high GPS sensitivity, and offers low-cost, fast-time-to-market Bluetooth functionality to next-generation mobile convergence devices.

Atmel to Review Unsolicited Proposal from Microchip and ON Semiconductor

Atmel(R) Corporation (Nasdaq: ATML) today confirmed that it has received an unsolicited proposal from Microchip Technology Inc. (Nasdaq: MCHP) and ON Semiconductor (Nasdaq: ONNN) to engage in negotiations for a three-way agreement to acquire Atmel at $5.00 per share, subject to conditions, including the sale of assets, due diligence, and financing. Atmel's Board of Directors, consistent with its fiduciary duties and in consultation with its independent financial and legal advisors, will review and consider the proposal in due course.

Morgan Stanley and Credit Suisse are serving as financial advisors, and Wachtell, Lipton Rosen & Katz is serving as legal counsel to Atmel.